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Thermal Management

Product Detail Information

Thermal Management

│Product info│

Product image

Feature

Applications

  • Protection Film

  • Glass Fiber

  • Thermal conductive gel pad

  • Release Film

  • Interface between various heat generating components and heat sinks or rails

  • Isolate electrical components and power sources from heat sink

  • Military, Medical devices

  • FPDs, Notebook PC and Mobile phones

  • Protection Film

  • Thermal conductive gel pad

  • Release Film

  • Between IC and heat sink or chassis & power components of various packages

  • Between other heat generating devices & chassis

  • DRAM memory modules & Power supply

  • CD / DVD ROM & HDD Cooling


SILICONE THERMAL PAD

NK-THM-1.5W

NK-THM-1.8W

NK-THM-3W

NK-THM-5W

NK-THM-7W

Test Method

Electrically & Thermal Properties

Dielectric Breakdown V

Vac

>10,000

>10,000

>6,000

>5,000

>5,000

ASTM D149

Dielectric Constant

1000Hz

5.5

5.5

6.5

7

7.5

ASTM D150

Volume Resistivity

Ω,㎝

10 14

10 14

10 11

10 11

10 11

ASTM D257

Shielding Effectiveness

dB

>80

>70

>40

>20

Min. 50

ASTM D4935

Thermal Conductivity

W/mk

1.5

1.8

3.0

5.0

7.0

ASTM D5470

Physical Properties

Reinforcement

 

Non Carrier or Fiberglass

Non Carrier

 

Thickness

mm

0.2 ~ 5

0.5 ~ 5

ASTM D374

Color

 

Dark grey, light grey, grey, yellow, pink, Ivory etc.

 

Adhesive

 

with adhesive or without adhesive

 

Specific Gravity

g/㎤

2.50 (+/-0.2)

2.70 (+/-0.2)

2.95 (+/-0.2)

3.10 (+/-0.2)

3.20 (+/-0.2)

ASTM D792

Hardness

Shore 00

50(±10)

50(±10)

60(±10)

65(±10)

65(±10)

ASTM D2240

Temperature Range

- 60 ~ + 200

- 60 ~ + 200

- 60 ~ + 200

- 60 ~ + 200

- 60 ~ + 200

 

Flame Resistance

 

V-0

V-0

V-0

V-0

V-0

UL94


* Inherent surface: Non tacky, one side or both sides
Product Detail Image

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